Products

Laser Grinding System

The LGSA is a fully automatic laser edge-grinding system. The LGS is able to remove the wafer edge, which contains micro-cracks from back grinding, without incurring additional damages associated such as ‘dry’ lasers and diamond saw bla-des. Moreover, the system is easy to use with its clear Man Machine Interface (MMI) capability.

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Synova's success – Electronics – Case Study

The machines on offer use the water-jet-guided laser technology (also called Laser-Microjet) for various micro-machining operations such as wafer dicing and edge grinding for the semiconductor industry, and cutting of hard materials such as CBN and PCD, PV solar …

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Tool grinding machine / PLC-controlled

Find out all of the information about the Synova product: tool grinding machine / PLC-controlled LGSA. Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.

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Laser_microJet_technology synova · lgs laser edge grinding machines

The water jet works as an optical fibre of variable length for guiding the laser beam. The Synergy of Water and Fire dicng marking slotting cutting edge-grinding milling scribing groovingSYNOVA The water jet cools the work pice during laser ablation. drilling ASIA PACIFIC cleaning isolating The water jet ejects the molten material.

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Machine for Laser Grinding of Wafers

Synova ? LGS ? Laser Edge Grinding Machines. The Laser Microjet wafer edge grinding machine is suitable for grinding, drilling and slotting of wafers It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strengt. Read More

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Laser Edge Grinding System

Laser Grinding System The LGSA is a fully automatic laser edge-grinding system. The LGS is able to remove the wafer edge, which contains micro-cracks from back grinding, without incurring additional damages associated with conventional cutting technologies such as ‘dry’ lasers and diamond saw blades. synova · lgs laser edge grinding machines

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S Metal Watches EPMTenglish-swissphotonics

synova · lgs laser edge grinding machines  &#; Synova Confidential Laser Microjet ... Laser Edge-Grinding System (LGS) with DIT Hybrid Laser Saw (HLS) with Disco ... (DCS) Laser Drilling System with Posalux Cutting of diamonds Machines with Manufacturing Partners Laser Cutting System (MCS) with Makino Tool Cutting / Turbine Drilling System (TCS / TDS) with Willemin-Macodel.

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Synova: Your supplier of water jet guided laser cutting ...

 &#; The Synova Story. SYNOVA’s story begins with the invention of the water jet guided laser developed in thes at the Federal Institute of Technology (EPFL) in Lausanne, Switzerland, made by PhD student Bernold Richerzhagen.This innovation resolved a number of well-known problems associated with existing cutting technologies in industrial applications.

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Cool Laser Machining

 &#; Innovative Laser Machining Systems Synova is the pioneer of a revolutionary water jet guided laser technology providing state-of-the-art cutting and dicing solutions as well as drilling and edge grinding systems for the energy, aerospace, tool, diamond, semiconductor, watchmaking, elec-tronic, automotive and medical industries.

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 &#; W toW. 、 SYNOVA SYNOVA General purpose Loading ...

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